THERMALLY CONDUCTIVE PRODUCTS

Protavic thermal materials are typically considered best-in-class products. Our products are commonly used for heat sink bonding with high thermal performance. They are also used for LED,s and industry standard die attach where heat is always on the rise. Whether its potting or adhesives, we can help. Please review our list of best sellers and left us know if you cannot locate a product to meet your needs.

Benefits

· Aray of materials to choose from
· UL-recognized products
· Custom formulations available
· Made with electronics-grade raw materials
· Products marked with an asterisk(*) are MixPac™-compatible

Note: For higher thermal performance with electrical conductivity, please refer to our Electrically Conductive product offering products.

 
Product Description Mixed Viscosity / CPS Specific
Gravity @ 25°C		 Thermal Conductivity Wm°K Operating Temp.°C
PTS-46323 Filled silicone system with excellent thermal properties (1.4Wm°K). Fast flow for void free applications. This material does not require primers and has good adhesion to most substrates. It is commonly used for the encapsualtion of power supplies and other high voltage devices. This material passes Belcore85/85 and UL 94v0. 10,000 2.2 1.4 -55 to +200
PTS-46313 Filled silicone system with excellent thermal properties (1.4Wm°K). Fast flow for void free applications. This material does not require primers and has good adhesion to most substrates. It is commonly used for the encapsualtion of power supplies and other high voltage devices. This material passes Belcore85/85 and UL 94v0. This product is a one part system which requires cold storage prior to use. It is an excellent product for small use or environments without mixing capabilities. 10,000 2.2 1.4 -55 to +200
PTS-46303 Filled silicone system with excellent thermal properties (1.4Wm°K). Fast flow for void free applications. This material does not require primers and has good adhesion to most substrates. It is commonly used for the encapsualtion of power supplies and other high voltage devices. This material passes Belcore85/85 and UL 94v0. (file E116296) 8,000 2.2 1.4 -55 to +200
PTE-47850 * Filled epoxy system, excellent thermally conductive (1.3Wm°K) potting material for void free applications. This material bonds well to glass, ceramic, metal and plastic (FR4). 2 hour gel time 20,000 2.0 1.3 -55 to +150
PTE-57851 * Filled epoxy system, excellent thermally conductive (1.3Wm°K) potting material for void free applications. This material bonds well to glass, ceramic, metal and plastic (FR4). 1 hour gel time. This product is available in various colors and viscosities. 40,000 2.0 1.3 -55 to +150
PTE-36977 Epoxy system for casting and encapsulation of high voltage coils where high temperature and high thermal conductivity are required. 40,000 1.75 1.3  
PNE-40824 * Filled Epoxy system designed to protect electronic devices from humidity and mechanical damage. This material provides near indestructible protective layer. Gel time of 20 minutes and can be cured at room temperature. 13,000 1.15 1.2 -55 to +200
PNE-30270 Filled epoxy system for semiconductor applications where protection is needed. This product is commonly used for glob top and various small device applications. It is a one-component system with > 5 days of pot life with a fast cure for inline use. This product is available in many viscosities. 70,000 1.7 1.0 -55 to +200
PNE-30273 Filled epoxy system for semiconductor applications where protection is needed. This product is commonly used for cavity fill, and various small device filling applications. It is a one-component system with 24 hour pot life with a fast cure for inline use. This product has a high TG (160) and low CTE (17) ideal for difficult product applications. 6,000 1.8 1.1 -55 to +210
PNE-20262 Filled epoxy system for semiconductor applications where protection is needed. This product is commonly used for cavity fill, and various small device filling applications. It is a one component system with 24 hour pot life with a fast cure for inline use. This product has a low CTE (10) ideal for difficult product applications where heat operation is not required.formerly L127-11 10,000 1.8 1.0 -55 to + 150
ATE-46446 Filled epoxy system for high thermal applications such as heat-sink bonding. This material has  2.2 Wm⁰K thermal performance with supporting laser flash data. Room temperature cure. 8,000 2.2 2.2 -55 to +175
IMPORTANT: The information contained in this data sheet corresponds to the present state of our knowledge; it is intended for your guidance but we are not bound by it since we are not in the position to exercise control over the manner in which our products are used. Moreover, the attention of the user is drawn to the risks that could occur should a product be used for an application other than for which it is intended.
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