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New Products Protavic is always working to develop new products and improve upon the performance and value of our existing product line. We’re always asking ourselves how we can do things better and more economically to provide you, our customers, with superior value. SEE WHAT'S NEW. · Low Modulus materials· Stacked Wafer Bonding materials · Conductive Hybrid for high rel die attach · Non-Conductive Hybrid for low stress · Reworkable Underfill formulation · Optically clear silicone with high RF LED encapsulation |
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| Product | Description | ||||
| ANE-47932 | Adhesive. Filled epoxy system. Very high performance material designed or difficult bonding applications. This material will bond to stencil foil without holes and can withstand high heat and harsh chemical environments, Requires heat assist. | ||||
| PNU-46220 | Encapsulant. Urethane system. This material is very tough with a 30 minute gel time. It is commonly used in the encapsulation of LED lighting with no yellowing and excellent light transmission. It's low viscosity offer fast flow with no voids. It is available in various colors. | ||||
| PNE-40824 | Adhesive & Encapsulant. Filled Epoxy system designed to protect electronic devices from humidity and mechanical damage. This material provides near indestructible protective layer. Gel time of 20 minutes and can be cured at room temperature. | ||||
| ANA 10199R | Re-workable Underfill. This product offers 100% cross linking at 80-100c and can be removed between 280-300c. | ||||
| ANE 10932 | Non-Conductive Coating for Bonding of Stacked Wafers. This material is perfectly adapted for high reliable ceramic attaching applications. Ideal for screen printing. | ||||
| ANH 20110 | Non-Conductive Hybrid Adhesive with high reliability. Low modulus and low stress for die bonding of aray and laminate based BGA packages. This product can withstand 260c with excellent moisture resistance. | ||||
| ACH 20120 | Conductive Hybrid Die-Attach onto lead frame with high adhesion after exposure to multiple reflows under humid conditions | ||||
| ACH 20130 | Conductive hybrid adhesive with high reliability. Low modulus and low stress for die bonding of array and laminate based BGA packages |
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| PNS 20100 | Clear, non-yellowing silicone for void free encapsulation and sealing, One part heat assist cure at low temperature. Low viscosity and long work life. Indeal LED encapsulantion material | ||||
| PNS 56225 | Clear, non-yellowing silicone for void free encapsulationand sealing. Two part 1:1 mix ratio with fast room temperature cure. This product is ideal for LED encapsulation. | IMPORTANT: The information contained in this data sheet corresponds to the present state of our knowledge; it is intended for your guidance but we are not bound by it since we are not in the position to exercise control over the manner in which our products are used. Moreover, the attention of the user is drawn to the risks that could occur should a product be used for an application other than for which it is intended. | |||
©2007. All rights reserved. Tel: (800) 807 2294 Fax: (800) 807 2294 info@protavicamerica.com |
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