MixPac™ Compatible Products

Protavic products are designed for ease of use, and MixPac™ helps us bring them to you. Our specialty is designing the best materials; Sulzer MixPac designs convenient packaging.

At Protavic, we will package our materials in the most convenient package for you. If you have a preferred package style, let us know and we will be happy offer it to you.

The MIXPAC® System is an integrated adhesive-dispensing solution consisting of a hand-held pneumatic or manual dispensing gun, a cartridge and a static mixer. The primary benefits are:

Cost Savings. The MIXPAC® System fills the void between elementary adhesive-handling systems designed for small applications and complex (expensive) meter, mix and dispensing equipment.

Flexibility. A 2-component adhesive is as easy to use as a single-component adhesive, thus increasing the number of choices for an application.

·NOTE: All the products listed below are available in Mixpac 50, 200 and 400ml size cartridges.
 
Product Description Mix Ratio / R:C Mixed Viscosity / CPS Tensile Strength / PSI Operating Temp. °C
ANE 26144 * Adhesive. Clear unfilled epoxy also available in a one-part system. Over three day use life after mixing at room temperature. Excellent for ferrite and optical bonding applications. Non-hazardous and safe to use. Requires heat assist to cure. 10:1 7,000 3,200 -55 to +180
ANE-47927 * Adhesive. Filled epoxy system. Excellent chemical and heat resistance. Excellent for stencil and screen bonding due to its high strength and fast cure at low temperatures. 2:1 50,000 3,000 -60 to +140
ANE-57103 * Adhesive. Fast cure 10-minute epoxy system. Excellent stacking and fixturing. This material is toughened for outstanding thermal shock resistance. 1:1 10,000 4,500 -50 to +130
ANE-47932 * Adhesive. Filled epoxy system. Very high performance material designed for difficult bonding applications. This material will bond to stencil foil without holes and can withstand high heat and harsh chemical environments. Requires heat assist. 1:1 40,000 3,200 -60 to +180
ANE-46505 * Adhesive. Amber epoxy system. Excellent for use in high heat (steam) and chemical environments. 2 hour gel time. Bonds well to metal, plastics and wood. High thermal shock resistance. Available in colors and higher or lower viscosities. Passes NASA outgassing requirements. 1:1 30,000 3,800 -55 to 140
ANE-46515 * Adhesive. Amber epoxy system for high strength applications. Bonds well to metals, plastics and wood. Can be use as a general purpose adhesive. 20-minute gel time. Available in colors and higher or lower viscosities. Passes NASA outgassing requirements. 1:1 40,000 4,500 -55 to +140
PNU-56200 * Adhesive & Encapsulant. Amber Urethane system. It offers a fast 5-minute cure and bonds well to metal, leather, vinyl and wood. It is electronics grade and is often used for wire stacking. It is flexible yet very tough to handle vibration applications. 1:1 5,000 2,000 -55 to +120
PNU-46202 * Adhesive & Encapsulant. Clear urethane system. This material does not yellow and can be used for bonding plastic, glass, and many other types of substrates. It is excellent for applications requiring flexibility. Gel time is 10 minutes. 1:1 5,000 2,000 -55 to +120
PNU-46203 * Adhesive & Encapsulant. Clear urethane system. This material is soft and slow cure, offering good fixturing time. It does not yellow and offers excellent adhesion to many substrates. It is available in various colors. 4:1 15,000 45A -55 to +125
PNU-46204 * Adhesive & Encapsulant. Amber urethane system. This material is hard and very fast to cure. It is also very low viscosity so fast flow for void free product is possible. It provides excellent adhesion to many substrates and is ideal for potting small electrical devices where flexibility is needed, yet tough durable protection is required. It is available in various colors. 1:1 1,000 70A -55 to +120
PNU-46220 * Encapsulant. Urethane system. This material is very tough with a 30-minute gel time. It is commonly used in the encapsulation of LED lighting with no yellowing and excellent light transmission. Its low viscosity offers fast flow with no voids. It is available in various colors. 1:1 1,500 65A -55 to +125
PTE-47850 * Encapsulant. Filled epoxy system, excellent thermally conductive (1.3Wm°K) potting material for void free applications. This material bonds well to glass, ceramic, metal and plastic (FR4). 2 hour gel time. 4:1 20,000 80D -55 to +150
PTE-57851 * Encapsulant. Filled epoxy system, excellent thermally conductive (1.3Wm°K) potting material for void free applications. This material bonds well to glass, ceramic, metal and plastic (FR4). 1 hour gel time. This product is available in various colors and viscosities. 4:1 40,000 90D -55 to +150
PNE-47207 * Encapsulant. Epoxy system, excellent for potting & casting applications. It will bond to difficult substrates and is flame retardant meeting UL 94v0. 1:1 20,000 75D -55 to +150
PNE-40824 * Adhesive & Encapsulant. Filled Epoxy system designed to protect electronic devices from humidity and mechanical damage. This material provides a near- indestructible protective layer. Gel time of 20 minutes and can be cured at room temperature. 2:1 13,000 95D -55 to +200
IMPORTANT: The information contained in this data sheet corresponds to the present state of our knowledge; it is intended for your guidance but we are not bound by it since we are not in the position to exercise control over the manner in which our products are used. Moreover, the attention of the user is drawn to the risks that could occur should a product be used for an application other than for which it is intended.
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