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POTTING & ENCAPSULATION RESINS Protavic potting and encapsulation resins are designed to perform in the most difficult environments. From Smart Cards to high power devices, our epoxies, urethanes, silicone and hybrids formulations are engineered to meet your needs. Please review the partial listing below of some of our best selling products. If you cannot find what you need, give us a call or send us an email.Benefits · Clear non-yellowing· UL Recognized products · Made with electronics-grade raw materials · Products marked with an asterisk(*) are MixPac™-compatible |
| Product | Description | Mixed Viscosity / CPS | Specific Gravity |
Shore Hardness |
Operating Temp. °C |
| PNU-46201 | Clear urethane system for protecting circuit applications. The material is UL recognized (file E116296) and is commonly used in casting applications. It is a re-workable material. | 30,000 | 1.2 | 45A | -55 to +125 |
| PTU-46201 | Filled urethane system for protecting circuit applications. The material is UL recognized (file E116296) and is thermally conductive version of PNU-46201. | 70,000 | 2.2 | 70A | -55 to +125 |
| PNU-46202 * | Clear urethane system. This material does not yellow and can be used for encapsulating plastic, glass and many other types of substrates. It is excellent for applications requiring toughness. Gel time is 10 minutes. It is available in various colors. | 5,000 | 1.15 | 60D | -55 to +120 |
| PNU-46203 * | Clear urethane system. This material is soft and slow cure, offering good fixturing time. It does not yellow and offers excellent adhesion to many substrates. It is available in various colors. | 15,000 | 1.2 | 45A | -55 to +125 |
| PNU-56204 * | Amber urethane system. This material is hard and very fast to cure. Its low viscosity offers fast flow with no voids. It provides excellent adhesion to many substrates and is ideal for potting small electrical devices where flexibility is needed, yet tough durable protection is required. It is available in various colors. | 2,000 | 1.1 | 70A | -55 to +120 |
| PNU-46220 * | Clear Urethane system. This material is very tough with a 30- minute gel time. It is commonly used in the encapsulation of LED lighting with no yellowing and excellent light transmission. Its low viscosity offers fast flow with no voids. It is available in various colors. | 1,500 | 1.2 | 65A | -55 to +125 |
| PTS-46323 | Filled silicone system with excellent thermal properties (1.4Wm⁰K). Fast flow for void- free applications. This material does not require primers and has good adhesion to most substrates. It is commonly used for the encapsualtion of power supplies and other high- voltage devices. This material passes Belcore85/85 and UL 94v0. | 10,000 | 2.2 | 60A | -55 to +200 |
| PTS-46313 | Filled silicone system with excellent thermal properties (1.4Wm⁰K). Fast flow for void- free applications. This material does not require primers and has good adhesion to most substrates. It is commonly used for the encapsualtion of power supplies and other high-voltage devices. This material passes Belcore85/85 and UL 94v0. This product is a one-part system that requires cold storage prior to use. It is an excellent product for small use or environments without mixing capabilities. | 10,000 | 2.2 | 60A | -55 to +200 |
| PTS-46303 | Filled silicone system with excellent thermal properties (1.4Wm⁰K). Fast flow for void- free applications. This material does not require primers and has good adhesion to most substrates. It is commonly used for the encapsualtion of power supplies and other high- voltage devices. This material passes Belcore85/85 and UL 94v0. (file E116296), formerly EGE-XX-303HK | 8,000 | 2.2 | 60A | -55 to +200 |
| PTE-47850 * | Filled epoxy system, excellent thermally conductive (1.3Wm⁰K) potting material for void- free applications. This material bonds well to glass, ceramic, metal and plastic (FR4). 2- hour gel time. | 20,000 | 2.0 | 80D | -55 to +150 |
| PTE-57851 * | Filled epoxy system, excellent thermally conductive (1.3Wm⁰K) potting material for void-free applications. This material bonds well to glass, ceramic, metal and plastic (FR4). 1-hour gel time. This product is available in various colors and viscosities. | 40,000 | 2.0 | 90D | -55 to +150 |
| PNE-47207 * | Epoxy system, excellent for potting and casting applications. It will bond to difficult substrates and is flame-retardant, meeting UL 94v0 standards. | 20,000 | 1.5 | 75D | -55 to +150 |
| PTE-36977 | Epoxy system for casting and encapsulation of high-voltage coils where high temperature and high thermal conductivity are required. | 40,000 | 1.75 | 95D | -55 to +150 |
| PNE-40824 * | Filled Epoxy system designed to protect electronic devices from humidity and mechanical damage. This material provides a near indestructible protective layer. Gel time of 20 minutes; can be cured at room temperature. | 13,000 | 1.15 | 95D | -55 to +200 |
| PNE-30270 | Filled epoxy system for semiconductor applications where protection is needed. This product is commonly used for glob top and various small device applications. It is a one-component system with > 5 days of pot life and a fast cure for inline use. This product is available in many viscosities. | 70,000 | 1.7 | 90D | -55 to +200 |
| PNE-30273 | Filled epoxy system for semiconductor applications where protection is needed. This product is commonly used for cavity fill, and various small device filling applications. It is a one-component system with 24-hour pot life and a fast cure for inline use. This product has a high TG (160) and low CTE (17), which makes it ideal for difficult product applications.formerly L127-3 | 6,000 | 1.8 | 90D | -55 to +210 |
| PNE-20262 | Filled epoxy system for semiconductor applications where protection is needed. This product is commonly used for cavity fill and various small device filling applications. It is a one-component system with 24-hour pot life and a fast cure for inline use. This product has a low CTE (10) ideal for difficult product applications where heat operation is not required.formerly L127-11 | 10,000 | 1.8 | 95D | -55 to + 150 |
| IMPORTANT: The information contained in this data sheet corresponds to the present state of our knowledge; it is intended for your guidance but we are not bound by it since we are not in the position to exercise control over the manner in which our products are used. Moreover, the attention of the user is drawn to the risks that could occur should a product be used for an application other than for which it is intended. | |||||
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